发现好书期刊，享受阅读乐趣

海量图书期刊资源，随时随地畅享阅读乐趣

[IEEE IEEE 2002 International Interconnect Technology Conference - Burlingame, CA, USA (3-5 June 2002)] Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) - Deposition of WN/sub x/C/sub y/ thin films by ALCVD/spl trade/ method for diffusion barriers in metallization

[IEEE IEEE 2002 International Interconnect Technology Conference - Burlingame, CA, USA (3-5 June 2002)] Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) - Deposition of WN/sub x/C/sub y/ thin films by ALCVD/spl trade/ method for diffusion barriers in metallization

Wei-Min Li, ; Kai Elers, ; Juhana Kostamo, ; Kaipio, S.; Huotari, H.; Soininen, M.; Soininen, P.J.; Tuominen, M.; Haukka, S.; Smith, S.; Besling, W.
  • 作者Wei-Min Li, ; Kai Elers, ; Juhana Kostamo, ; Kaipio, S.; Huotari, H.; Soininen, M.; Soininen, P.J.; Tuominen, M.; Haukka, S.; Smith, S.; Besling, W.
  • 文件大小174.71KB
  • 发表时间2002
  • DOI10.1109/iitc.2002.1014930
  • 页码191-193
同期刊推荐
← 返回【学霸图书馆】主页
© 2026 学霸图书馆 · 让阅读成为习惯