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[IEEE IEEE 2002 International Interconnect Technology Conference - Burlingame, CA, USA (3-5 June 2002)] Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) - Cu dual damascene interconnects in porous organosilica film with organic hard-mask and etch-stop layers for 70 nm-node ULSIs

[IEEE IEEE 2002 International Interconnect Technology Conference - Burlingame, CA, USA (3-5 June 2002)] Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) - Cu dual damascene interconnects in porous organosilica film with organic hard-mask and etch-stop layers for 70 nm-node ULSIs

Tada, M.; Harada, Y.; Hijioka, K.; Ohtake, H.; Takeuchi, T.; Saito, S.; Onodera, T.; Hiroi, M.; Furutake, N.; Hayashi, Y.
  • 作者Tada, M.; Harada, Y.; Hijioka, K.; Ohtake, H.; Takeuchi, T.; Saito, S.; Onodera, T.; Hiroi, M.; Furutake, N.; Hayashi, Y.
  • 文件大小215.50KB
  • 发表时间2002
  • DOI10.1109/iitc.2002.1014872
  • 页码12-14
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