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SPIE Proceedings [SPIE Design, Process Integration, and Characterization for Microelectronics - Santa Clara, CA (Wednesday 6 March 2002)] Design, Process Integration, and Characterization for Microelectronics - <title>GDS-3 initiative: advanced design-through-chip infrastructure for subwavelength technology</title>

SPIE Proceedings [SPIE Design, Process Integration, and Characterization for Microelectronics - Santa Clara, CA (Wednesday 6 March 2002)] Design, Process Integration, and Characterization for Microelectronics - GDS-3 initiative: advanced design-through-chip infrastructure for subwavelength technology

Pack, Robert C.; Heins, Mitchell D.; Chatila, Ahmad R.; Boksha, Victor V.; Cottrell, D.; Berglund, C. Neil; Hogan, J.; James, F.; Vucurevich, T.; Bales, M.; Shimasaki, K.; Starikov, Alexander; Tobin, Jr., Kenneth W.
  • 作者Pack, Robert C.; Heins, Mitchell D.; Chatila, Ahmad R.; Boksha, Victor V.; Cottrell, D.; Berglund, C. Neil; Hogan, J.; James, F.; Vucurevich, T.; Bales, M.; Shimasaki, K.; Starikov, Alexander; Tobin, Jr., Kenneth W.
  • 卷第4692卷
  • 印刷ISSN0277-786X
  • 文件大小1112.65KB
  • 发表时间2002
  • DOI10.1117/12.475667
  • 页码566-584
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