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Degradation mechanism of ag-epoxy conductive adhesive/Sn-Pb plating interface by heat exposure

Degradation mechanism of ag-epoxy conductive adhesive/Sn-Pb plating interface by heat exposure

M. Yamashita; K. Suganuma

作者M. Yamashita; K. Suganuma
卷第31卷
期第6期
印刷ISSN0361-5235
电子ISSN1543-186X
文件大小426.30KB
发表时间2002
DOI10.1007/s11664-002-0124-5
页码551-556

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