Electromigration in integrated circuit interconnects studied by X-ray microscopy

• 作者G. Schneider; G. Denbeaux; E. Anderson; W. Bates; F. Salmassi; P. Nachimuthu; A. Pearson; D. Richardson; D. Hambach; N. Hoffmann; W. Hasse; K. Hoffmann
• 卷第199卷
• 印刷ISSN0168-583X
• 文件大小261.66KB
• 发表时间2003
• DOI10.1016/s0168-583x(02)01565-3
• 页码469-474