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[IEEE ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings - Shanghai, China (2003.10.28-2003.10.30)] Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. - A ceramic pin grid array package with 370 I/O leads

[IEEE ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings - Shanghai, China (2003.10.28-2003.10.30)] Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. - A ceramic pin grid array package with 370 I/O leads

Ji Chunfeng, ; Fu Hualiang, ; Zheng Hongyu, ; Liu Qiaoming,

作者Ji Chunfeng, ; Fu Hualiang, ; Zheng Hongyu, ; Liu Qiaoming,
文件大小167.77KB
发表时间2003
DOI10.1109/eptc.2003.1298704
页码115-116

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