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[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - P/sup +/ silicon recessed micromechanical structures for MEMS applications

[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - P/sup +/ silicon recessed micromechanical structures for MEMS applications

Pal, P.; Tuli, S.; Chandra, S.

作者Pal, P.; Tuli, S.; Chandra, S.
文件大小239.42KB
发表时间2003
DOI10.1109/dtip.2003.1287072
页码378-381

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