Lead-free soldering in the Japanese electronics industry
- 期刊名称IEEE Transactions on Components and Packaging Technologies
- 作者Fukuda, Y.; Pecht, M.G.; Fukuda, K.; Fukuda, S.
- 卷第26卷
- 期第3期
- 印刷ISSN1521-3331
- 文件大小331.70KB
- 发表时间2003-09
- DOI10.1109/TCAPT.2003.817658
- 页码616-624
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