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[IEEE IEEE International Interconnect Technology Conference - Burlingame, CA, USA (2-4 June 2003)] Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) - The application of ALD WN/sub x/C/sub y/ as a copper diffusion barrier

[IEEE IEEE International Interconnect Technology Conference - Burlingame, CA, USA (2-4 June 2003)] Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) - The application of ALD WN/sub x/C/sub y/ as a copper diffusion barrier

Smith, S.; Book, G.; Li, W.M.; Sun, Y.M.; Gillespie, P.; Tuominen, M.; Pfeifer, K.
  • 作者Smith, S.; Book, G.; Li, W.M.; Sun, Y.M.; Gillespie, P.; Tuominen, M.; Pfeifer, K.
  • 文件大小247.88KB
  • 发表时间2003
  • DOI10.1109/iitc.2003.1219734
  • 页码135-137
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