Surface property of passivation layer on integrated circuit chip and solder mask layer on printed circuit board [Abstracts of Forthcoming Manuscripts]

• 期刊名称IEEE Transactions on Electronics Packaging Manufacturing
• 作者Shijian Luo, ; Wong, C.P.
• 卷第26卷
• 期第4期
• 印刷ISSN1521-334X
• 文件大小146.94KB
• 发表时间2003-10
• DOI10.1109/tepm.2003.823169
• 页码266-266