Au Bump Interconnection in 20 µm Pitch on 3D Chip Stacking Technology
- 期刊名称Japanese Journal of Applied Physics
- 作者Tanida, Kazumasa; Umemoto, Mitsuo; Morifuji, Tadahiro; Kajiwara, Ryoichi; Ando, Tatsuya; Tomita, Yoshihiro; Tanaka, Naotaka; Takahashi, Kenji
- 卷第42卷
- 印刷ISSN0021-4922
- 电子ISSN1347-4065
- 文件大小247.66KB
- 发表时间2003-10-9
- DOI10.1143/jjap.42.6390
- 页码6390-6395
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