[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Constrained-sintered, low-temperature Co-fired ceramic for IC packaging applications
Needes, C.R.; Barker, M.F.; Ollivier, P.T.; Hang, K.W.; Souders, K.E.; Wang, C.B.; Smith, M.A.
- 作者Needes, C.R.; Barker, M.F.; Ollivier, P.T.; Hang, K.W.; Souders, K.E.; Wang, C.B.; Smith, M.A.
- 文件大小629.64KB
- 发表时间2003
- DOI10.1109/ectc.2003.1216252
- 页码30-35