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[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (July 6–11, 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 - Deformation Characteristics of Solder Joints

[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (July 6–11, 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 - Deformation Characteristics of Solder Joints

Bastawros, Ashraf; Antoniou, Antonia

作者Bastawros, Ashraf; Antoniou, Antonia
文件大小772.43KB
发表时间2003
DOI10.1115/IPACK2003-35078
页码303-307

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