SAE Technical Paper Series [SAE International SAE 2003 World Congress & Exhibition - (MAR. 03, 2003)] SAE Technical Paper Series - Thermoformed Soft Instrument Panel
- 作者Woodman, Daniel
- 卷第1卷
- 印刷ISSNArra-y
- 文件大小657.73KB
- 发表时间2003
- DOI10.4271/2003-01-1171
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