发现好书期刊，享受阅读乐趣

海量图书期刊资源，随时随地畅享阅读乐趣

[IEEE Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004. - Honolulu, HI, USA (2004.06.17-2004.06.17)] Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004. - Highly reliable, 65 nm-node Cu dual damascene interconnects with full porous-SiOCH (k=2.5) films for low-power ASICs

[IEEE Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004. - Honolulu, HI, USA (2004.06.17-2004.06.17)] Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004. - Highly reliable, 65 nm-node Cu dual damascene interconnects with full porous-SiOCH (k=2.5) films for low-power ASICs

Ueki, M.; Narihiro, M.; Ohtake, H.; Tagami, M.; Tada, M.; Ito, F.; Harada, Y.; Abe, M.; Inoue, N.; Arai, K.; Takeuchi, T.; Saito, S.; Onodera, T.; Furutake, N.; Hiroi, M.; Sekine, M.; Hayashi, Y.
  • 作者Ueki, M.; Narihiro, M.; Ohtake, H.; Tagami, M.; Tada, M.; Ito, F.; Harada, Y.; Abe, M.; Inoue, N.; Arai, K.; Takeuchi, T.; Saito, S.; Onodera, T.; Furutake, N.; Hiroi, M.; Sekine, M.; Hayashi, Y.
  • 文件大小204.01KB
  • 发表时间2004
  • DOI10.1109/vlsit.2004.1345393
  • 页码60-61
同期刊推荐
← 返回【学霸图书馆】主页
© 2026 学霸图书馆 · 让阅读成为习惯