Acoustic Monitoring of Electrochemical Deposition
- 期刊名称IEEE Transactions on Electronics Packaging Manufacturing
- 作者Williams, F.R.; May, G.S.
- 卷第27卷
- 期第3期
- 印刷ISSN1521-334X
- 文件大小750.62KB
- 发表时间2004-07
- DOI10.1109/tepm.2004.843087
- 页码198-209
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