[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Microstructure evolution and shear strength of Sn-3.5Ag-RE lead-free BGA solder balls

• 作者Law, C.M.T.; Wu, C.M.L.
• 文件大小1168.53KB
• 发表时间2004
• DOI10.1109/hpd.2004.1346674
• 页码60-65