Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization
Sohn, Y.C.; Yu, Jin; Kang, S.K.; Shih, D.Y.; Lee, T.Y.
- 期刊名称Journal of Materials Research
- 作者Sohn, Y.C.; Yu, Jin; Kang, S.K.; Shih, D.Y.; Lee, T.Y.
- 卷第19卷
- 期第8期
- 印刷ISSN0884-2914
- 电子ISSN2044-5326
- 文件大小1790.36KB
- 发表时间2004-8
- DOI10.1557/jmr.2004.0297
- 页码2428-2436