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Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization

Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization

Sohn, Y.C.; Yu, Jin; Kang, S.K.; Shih, D.Y.; Lee, T.Y.
  • 期刊名称Journal of Materials Research
  • 作者Sohn, Y.C.; Yu, Jin; Kang, S.K.; Shih, D.Y.; Lee, T.Y.
  • 卷第19卷
  • 期第8期
  • 印刷ISSN0884-2914
  • 电子ISSN2044-5326
  • 文件大小1790.36KB
  • 发表时间2004-8
  • DOI10.1557/jmr.2004.0297
  • 页码2428-2436
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