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SPIE Proceedings [SPIE Photonics Technologies for Robotics, Automation, and Manufacturing - Providence, RI (Monday 27 October 2003)] Environmentally Conscious Manufacturing III - <title>Use of data envelopment analysis for product recovery</title>

SPIE Proceedings [SPIE Photonics Technologies for Robotics, Automation, and Manufacturing - Providence, RI (Monday 27 October 2003)] Environmentally Conscious Manufacturing III - Use of data envelopment analysis for product recovery

Kongar, N. Elif; Gupta, Surendra M.; McGovern, Seamus M.; Gupta, Surendra M.

作者Kongar, N. Elif; Gupta, Surendra M.; McGovern, Seamus M.; Gupta, Surendra M.
卷第5262卷
印刷ISSN0277-786X
文件大小159.55KB
发表时间2004
DOI10.1117/12.516530
页码219-231

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