Microscopic Experimental Investigation on Shear Failure of Solder Joints

• 作者K. J. Lau; C. Y. Tang; P. C. Tse; C. L. Chow; S. P. Ng; C. P. Tsui; B. Rao
• 卷第130卷
• 期第3期
• 印刷ISSN0376-9429
• 电子ISSN1573-2673
• 文件大小896.74KB
• 发表时间2004-12
• DOI10.1007/s10704-004-2311-2
• 页码617-634