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Solvation of copper ions by imidazole: Structures and sequential binding energies of Cu+(imidazole)x, x= 1?4. Competition between ion solvation and hydrogen bonding

Solvation of copper ions by imidazole: Structures and sequential binding energies of Cu+(imidazole)x, x= 1?4. Competition between ion solvation and hydrogen bonding

Rannulu, N. S.; Rodgers, M. T.

期刊名称Physical Chemistry Chemical Physics
作者Rannulu, N. S.; Rodgers, M. T.
卷第7卷
期第5期
印刷ISSN1463-9076
电子ISSN1463-9084
文件大小850.19KB
发表时间2005
DOI10.1039/B418141G

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