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[IEEE IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Austin, TX, USA (Oct. 24-26, 2005)] IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Fully integrated AC coupled interconnect using buried bumps

[IEEE IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Austin, TX, USA (Oct. 24-26, 2005)] IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Fully integrated AC coupled interconnect using buried bumps

Wilson, J.; Mick, S.; Jian Xu, ; Lei Luo, ; Bonafede, S.; Huffman, A.; LaBennett, R.; Franzon, P.
  • 作者Wilson, J.; Mick, S.; Jian Xu, ; Lei Luo, ; Bonafede, S.; Huffman, A.; LaBennett, R.; Franzon, P.
  • 文件大小2845.93KB
  • 发表时间2005
  • DOI10.1109/epep.2005.1563686
  • 页码7-10
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