[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Compact electro-thermal model of semiconductor device with nonlinear convection coefficient
Feng, L.H.; Rudnyi, E.B.; Korvink, J.G.; Bohm, C.; Hauck, T.
- 作者Feng, L.H.; Rudnyi, E.B.; Korvink, J.G.; Bohm, C.; Hauck, T.
- 文件大小571.12KB
- 发表时间2005
- DOI10.1109/esime.2005.1502831
- 页码372-375