[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Experimental investigation of the adhesion dilation with negative thermal expansion LiAlSi/sub 2/O/sub 6/ fillers
Tsai, H-H.; Cheng, C.D.; Shieh, W.B.; Lee, K.T.; Feng, H.P.
- 作者Tsai, H-H.; Cheng, C.D.; Shieh, W.B.; Lee, K.T.; Feng, H.P.
- 文件大小560.18KB
- 发表时间2005
- DOI10.1109/esime.2005.1502850
- 页码467-470