Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn–Ag–Cu flip-chip solder interconnects

• 作者Dezhi Li; Changqing Liu; Paul P. Conway
• 卷第391卷
• 印刷ISSN0921-5093
• 文件大小810.71KB
• 发表时间2005
• DOI10.1016/j.msea.2004.10.007
• 页码95-103