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[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Experimental Investigation of the Miniature Loop Heat Pipe With Flat Evaporator

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Experimental Investigation of the Miniature Loop Heat Pipe With Flat Evaporator

Singh, Randeep; Akbarzadeh, Aliakbar; Mochizuki, Masataka; Nguyen, Thang; Wuttijumnong, Vijit
  • 作者Singh, Randeep; Akbarzadeh, Aliakbar; Mochizuki, Masataka; Nguyen, Thang; Wuttijumnong, Vijit
  • DOI210.0000/proceedings.asmedigitalcollection.asme.org/generic-998735364B5C
  • 文件大小328.54KB
  • 发表时间2005
  • DOI10.1115/IPACK2005-73498
  • 页码697-702
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