[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Cu-Direct Via-Hole Drilling of Aramid Fiber Reinforced Build-Up Layer by CO
Aoyama, Eiichi; Hirogaki, Toshiki; Ogawa, Keiji; Doi, Nobuyuki; Minagi, Ryu
- 作者Aoyama, Eiichi; Hirogaki, Toshiki; Ogawa, Keiji; Doi, Nobuyuki; Minagi, Ryu
- 文件大小752.50KB
- 发表时间2005
- DOI10.1115/ipack2005-73114
- 页码1797-1804