Fatigue Strength of BGA Type Solder Joints between Package and Printed Wiring Board of Portable Device
- 期刊名称Transactions of the Japan Society of Mechanical Engineers Series A
- 作者NAGANO, Kohta; YAGUCHI, Akihiro; TERASAKI, Takeshi; YAMADA, Munehiro
- 卷第71卷
- 期第701期
- 印刷ISSN0387-5008
- 电子ISSN1884-8338
- 文件大小7210.81KB
- 发表时间2005
- DOI10.1299/kikaia.71.177
- 页码177-184
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