Effect of Cu diffusion through Ni on the interfacial reactions of Sn3.5Ag0.75Cu and SnPb solders with Au/Ni/Cu substrate during aging

• 作者H.T. Chen; C.Q. Wang; M.Y. Li; D.W. Tian
• 卷第60卷
• 印刷ISSN0167-577X
• 文件大小584.30KB
• 发表时间2006
• DOI10.1016/j.matlet.2005.11.093
• 页码1669-1672