[IEEE 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (2006.7.3-2006.7.3)] 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Effect of Wire Thickness on Electromigration and Stress Migration Lifetime of Cu
Christiansen, Cathryn; Gambino, Jeff; Therrien, Joe; Hunt, Doug; Gill, Jason
- 作者Christiansen, Cathryn; Gambino, Jeff; Therrien, Joe; Hunt, Doug; Gill, Jason
- 文件大小5304.47KB
- 发表时间2006
- DOI10.1109/ipfa.2006.250985
- 页码349-354