发现好书期刊，享受阅读乐趣

海量图书期刊资源，随时随地畅享阅读乐趣

[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Current density and hot spot prediction using electrical-thermal co-simulation for multi-layer IC packages

[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Current density and hot spot prediction using electrical-thermal co-simulation for multi-layer IC packages

Chee-Hoe, Lin; Wui-Weng, Wong; Bao-Min, Liu

作者Chee-Hoe, Lin; Wui-Weng, Wong; Bao-Min, Liu
文件大小326.22KB
发表时间2006
DOI10.1109/EPTC.2006.342823
页码849-852

← 返回【学霸图书馆】主页