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[IEEE 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Shanghai, China (2005.6.27-2005.6.27)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Circuit Tracks on 3-D Thermoplastic Surfaces

[IEEE 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Shanghai, China (2005.6.27-2005.6.27)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Circuit Tracks on 3-D Thermoplastic Surfaces

Laine-Ma, Teija; Kujansuu, Jani; Pesonen, Matti; Maattanen, Jarmo

作者Laine-Ma, Teija; Kujansuu, Jani; Pesonen, Matti; Maattanen, Jarmo
文件大小268.44KB
发表时间2006
DOI10.1109/hdp.2005.251414
页码1-6

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