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[IEEE 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Shanghai, China (2005.6.27-2005.6.27)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - High Strain Rate Testing of Solder Interconnections

[IEEE 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Shanghai, China (2005.6.27-2005.6.27)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - High Strain Rate Testing of Solder Interconnections

Tsai, K.t.; Liu, F.; Wong, E.h.; Rajoo, R.

作者Tsai, K.t.; Liu, F.; Wong, E.h.; Rajoo, R.
文件大小295.93KB
发表时间2006
DOI10.1109/hdp.2005.251396
页码1-6

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