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[IEEE 2006 IEEE International Conference on Semiconductor Electronics - Kuala Lumpur, Malaysia (2006.10.29-2006.12.1)] 2006 IEEE International Conference on Semiconductor Electronics - Physical-Based SPICE Model of CMOS STI y-Stress Effect

[IEEE 2006 IEEE International Conference on Semiconductor Electronics - Kuala Lumpur, Malaysia (2006.10.29-2006.12.1)] 2006 IEEE International Conference on Semiconductor Electronics - Physical-Based SPICE Model of CMOS STI y-Stress Effect

Tan, Philip Beow Yew; Kordesch, Albert Victor; Sidek, Othman
  • 作者Tan, Philip Beow Yew; Kordesch, Albert Victor; Sidek, Othman
  • 文件大小1506.03KB
  • 发表时间2006
  • DOI10.1109/smelec.2006.380737
  • 页码755-758
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