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[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Moisture absorption mechanism in epoxy molding compounds used in IC encapsulation

[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Moisture absorption mechanism in epoxy molding compounds used in IC encapsulation

Premkumar, Jeromerajan; Srikanth, Narasimalu

作者Premkumar, Jeromerajan; Srikanth, Narasimalu
文件大小237.52KB
发表时间2006
DOI10.1109/eptc.2006.342691
页码60-62

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