Design of Air and Liquid Cooling Systems for Electronic Components Using Concurrent Simulation and Experiment
- 期刊名称Journal of Electronic Packaging
- 作者Icoz, Tunc; Verma, Nitin; Jaluria, Yogesh
- 卷第128卷
- 期第4期
- 印刷ISSN1043-7398
- 文件大小503.58KB
- 发表时间2006
- DOI10.1115/1.2353284
Orthogonal Microcutting of Thin WorkpiecesKushendarsyah, Saptaji; Sathyan, Subbiah · Journal of Manufacturing Science and Engineering · 2013
Methods for Improving Chucking AccuracyByun, Jeongmin; Liu, C. Richard · Journal of Manufacturing Science and Engineering · 2012
Assembly System Reconfiguration PlanningBryan, April; Hu, S. Jack; Koren, Yoram · Journal of Manufacturing Science and Engineering · 2013
Additive Manufacturing of GlassLuo, Junjie; Pan, Heng; Kinzel, Edward C. · Journal of Manufacturing Science and Engineering · 2014
Precision Laser DeburringLee, Seoung Hwan; Dornfeld, David A. · Journal of Manufacturing Science and Engineering · 2001
Rolling at Small ScalesNielsen, Kim L.; Niordson, Christian F.; Hutchinson, John W. · Journal of Manufacturing Science and Engineering · 2015
Economical and Ecological Cryogenic MachiningHong, Shane Y. · Journal of Manufacturing Science and Engineering · 2001
Data Mining for Subassembly SelectionAgard, Bruno; Kusiak, Andrew · Journal of Manufacturing Science and Engineering · 2004