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[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - Thermal Shock Testing as a Reliability Qualification Test for Lead-Free Solder

[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - Thermal Shock Testing as a Reliability Qualification Test for Lead-Free Solder

Goray, Kunal; Mahalingam, Saketh; Shah, Amit; Dasgupta, Abhijit
  • 作者Goray, Kunal; Mahalingam, Saketh; Shah, Amit; Dasgupta, Abhijit
  • 卷第2006卷
  • 文件大小897.52KB
  • 发表时间2006
  • DOI10.1115/imece2006-15561
  • 页码139-143
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