[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - Coupled Thermal-Stress Analysis for FC-BGA Packaging Reliability Design
- 作者Hirohata, Kenji; Hisano, Katsumi; Kawakami, Takashi; Aoki, Hideo; Takubo, Chiaki; Takahashi, Kuniaki; Pecht, Michael G.
- 卷第2006卷
- 文件大小760.97KB
- 发表时间2006
- DOI10.1115/imece2006-13800
- 页码289-303
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