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[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - The 1<sup>st</sup> Level & 2<sup>nd</sup> Level Solder Joint Reliability Co-design for Larger Die Flip Chip Package

[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - The 1^st Level & 2^nd Level Solder Joint Reliability Co-design for Larger Die Flip Chip Package

Biswas, Kalyan; Liu, Shiguo; Zhang, Xiaowu; Chai, TC

作者Biswas, Kalyan; Liu, Shiguo; Zhang, Xiaowu; Chai, TC
文件大小542.56KB
发表时间2007
DOI10.1109/EPTC.2007.4469772
页码32-36

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