Wafer-Level Modular Testing of Core-Based SoCs

• 期刊名称IEEE Transactions on Very Large Scale Integration (VLSI) Systems
• 作者Bahukudumbi, Sudarshan; Chakrabarty, Krishnendu
• 卷第15卷
• 期第10期
• 印刷ISSN1063-8210
• 文件大小863.70KB
• 发表时间2007-10
• DOI10.1109/tvlsi.2007.903943
• 页码1144-1154