[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - Investigation of Mechanical Reliability of Cu/low-k Multi-layer Interconnects in Flip Chip Packages
- 作者Uchibori, Chihiro J.; Zhang, Xuefeng; Im, Sehyuk; Ho, Paul S.; Nakamura, Tomoji
- 文件大小428.37KB
- 发表时间2007
- DOI10.1109/esime.2007.360022
- 页码1-5
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