High Temperature Embedded SiC Chip Module (ECM) for Power Electronics Applications
- 期刊名称IEEE Transactions on Power Electronics
- 作者Yin, Jian; Liang, Zhenxian; van Wyk, Jacobus Daniel
- 卷第22卷
- 期第2期
- 印刷ISSN0885-8993
- 文件大小1111.32KB
- 发表时间2007-03
- DOI10.1109/tpel.2006.889901
- 页码392-398
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