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[IEEE 2007 Asia and South Pacific Design Automation Conference - Yokohama, Japan (2007.01.23-2007.01.26)] 2007 Asia and South Pacific Design Automation Conference - AWafer-Level Defect Screening Technique to Reduce Test and Packaging Costs for

[IEEE 2007 Asia and South Pacific Design Automation Conference - Yokohama, Japan (2007.01.23-2007.01.26)] 2007 Asia and South Pacific Design Automation Conference - AWafer-Level Defect Screening Technique to Reduce Test and Packaging Costs for "Big-D/Small-A" Mixed-Signal SoCs

Bahukudumbi, Sudarshan; Ozev, Sule; Chakrabarty, Krishnendu; Iyengar, Vikram

作者Bahukudumbi, Sudarshan; Ozev, Sule; Chakrabarty, Krishnendu; Iyengar, Vikram
文件大小482.93KB
发表时间2007
DOI10.1109/aspdac.2007.358091
页码823-828

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