发现好书期刊，享受阅读乐趣

海量图书期刊资源，随时随地畅享阅读乐趣

[IEEE 2007 IEEE/MTT-S International Microwave Symposium - Honolulu, HI, USA (2007.06.3-2007.06.8)] 2007 IEEE/MTT-S International Microwave Symposium - High Value Passive Component Integration in LTCC Technology

[IEEE 2007 IEEE/MTT-S International Microwave Symposium - Honolulu, HI, USA (2007.06.3-2007.06.8)] 2007 IEEE/MTT-S International Microwave Symposium - High Value Passive Component Integration in LTCC Technology

Hoppenjans, Eric E.; Chappell, William J.

作者Hoppenjans, Eric E.; Chappell, William J.
文件大小3883.02KB
发表时间2007
DOI10.1109/mwsym.2007.380147
页码1913-1916

← 返回【学霸图书馆】主页