[IEEE 2007 7th IEEE Conference on Nanotechnology (IEEE-NANO) - Hong Kong, China (2007.08.2-2007.08.5)] 2007 7th IEEE Conference on Nanotechnology (IEEE NANO) - UV Enhanced low temperature wafer direct bonding and interface quality test
- 作者Xiaohui Lin, ; Tielin Shi, ; Guanglan Liao, ; Zirong Tang, ; Shiyuan Liu, ; Lei Nie,
- 文件大小2744.77KB
- 发表时间2007
- DOI10.1109/nano.2007.4601296
- 页码754-758
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