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Crack Growth Characteristics of Pure Copper for Smart Stress Memory Patch

Crack Growth Characteristics of Pure Copper for Smart Stress Memory Patch

Nambu, Shoichi; Enoki, Manabu

期刊名称Key Engineering Materials
作者Nambu, Shoichi; Enoki, Manabu
电子ISSN1662-9795
文件大小345.94KB
发表时间2007
DOI10.4028/www.scientific.net/KEM.353-358.2045
页码2045-2048

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