SPIE Proceedings [SPIE Integrated Optoelectronic Devices 2007 - San Jose, CA (Saturday 20 January 2007)] Photonics Packaging, Integration, and Interconnects VII - 3-D microoptic systems integration: advances in fabrication and packaging
- 作者Jahns, J.; Bohling, M.; Jarczynski, M.; Seiler, Th.; Earman, Allen M.; Chen, Ray T.
- 卷第6478卷
- 印刷ISSN0277-786X
- 文件大小723.22KB
- 发表时间2007
- DOI10.1117/12.714299