发现好书期刊，享受阅读乐趣

海量图书期刊资源，随时随地畅享阅读乐趣

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Thermo-mechanical analysis of a wafer level packaging by induction heating

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Thermo-mechanical analysis of a wafer level packaging by induction heating

Wenming Liu, ; Mingxiang Chen, ; Yanyan Xi, ; Changyong Lin, ; Sheng Liu,

作者Wenming Liu, ; Mingxiang Chen, ; Yanyan Xi, ; Changyong Lin, ; Sheng Liu,
文件大小1324.99KB
发表时间2008
DOI10.1109/ICEPT.2008.4606963
页码1-5

← 返回【学霸图书馆】主页