[IEEE 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Penang, Malaysia (2008.11.4-2008.11.6)] 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Building a Delamination-free Electronic Package Using Thermal Analysis Data

• 作者Dal, Sheila Liza B.
• 文件大小1641.08KB
• 发表时间2008
• DOI10.1109/IEMT.2008.5507861
• 页码1-5