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[IEEE 2008 IEEE 9th VLSI Packaging Workshop of Japan - Kyoto, Japan (2008.12.1-2008.12.2)] 2008 IEEE 9th VLSI Packaging Workshop of Japan - A chip stacking technology utilizing transmission line coupling

[IEEE 2008 IEEE 9th VLSI Packaging Workshop of Japan - Kyoto, Japan (2008.12.1-2008.12.2)] 2008 IEEE 9th VLSI Packaging Workshop of Japan - A chip stacking technology utilizing transmission line coupling

Daisuke Iguchi, ; Yutaka Akiyama, ; Tsuneo Ito, ; Kanji Otsuka,

作者Daisuke Iguchi, ; Yutaka Akiyama, ; Tsuneo Ito, ; Kanji Otsuka,
文件大小2450.12KB
发表时间2008
DOI10.1109/vpwj.2008.4762212
页码77-80

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